The S-7000 High Precision X-Ray Inspection Machine is designed for professional non-destructive inspection of electronic components, PCB assemblies, BGA solder joints, FPC cables, SMT mounting areas, IC packages, LED components, batteries and precision electronic parts. With its micro-focus X-ray source, high-resolution detector system and advanced inspection software, the S-7000 provides clear internal imaging for defect analysis, quality control and production inspection processes.

This model is equipped with a sealed micro-focus X-ray tube, 90 kV / 100 kV optional tube voltage, 250 uA tube current and a 5 μm focal spot. The system provides up to 200X magnification, making it suitable for detailed inspection of small solder joints, hidden connections, bubbles, voids and internal structural defects. The panel detector features 85 μm pixel pitch and a 300 mm × 350 mm inspection area, allowing accurate imaging for a wide range of electronic products.

The S-7000 includes point-to-point, line-to-line and angle measurement tools, as well as bubble calculation and BGA void detection functions. Its software supports advanced inspection routines, macro recording, automatic BGA detection and NC programming. Users can adjust stage speed, control X, Y, Z1 and Z2 axis movements, set voltage and current, adjust brightness and contrast, and export test results to Excel for review and archiving.

Key Features:

• High precision X-ray inspection system for electronics and PCB quality control
• Sealed micro-focus X-ray tube with 5 μm focal spot
• 90 kV / 100 kV optional tube voltage
• 85 μm pixel pitch panel detector
• 300 mm × 350 mm inspection area
• Up to 200X system magnification
• BGA void detection and automatic calculation
• FPC, SMT, PCB, IC, LED and battery inspection capability
• Point-to-point, line-to-line and angle measurement functions
• Automatic BGA detection program
• NC programming support
• Adjustable image settings including brightness, contrast and exposure
• Computer-controlled kV, mA and stage movement
• Radiation leakage less than 1 μSv/h
• Suitable for professional laboratory, repair, production and quality control environments

Technical Specifications:

• Model: S-7000
• Tube Style: Sealed tube
• Tube Voltage: 90 kV / 100 kV optional
• Tube Current: 250 uA
• Focal Spot: 5 μm
• Optical Tube Power: 8 W
• System Magnification: 200X
• Pixel Pitch: 85 μm
• Inspection Area: 300 mm × 350 mm
• X-Axis: 350 mm
• Y-Axis: 400 mm
• Z1-Axis: 380 mm
• Z2-Axis: 380 mm
• Platform Deadweight: 10 kg
• Power Supply: AC 110–230 V, 50/60 Hz
• Computer: Dell
• Operating System: Windows 10
• Display: 24” LCD
• CPU: Intel i5 6500
• Radiation Leakage: < 1 μSv/h
• Dimensions: 1010 × 930 × 1660 mm
• Weight: 820 kg
• Warranty: 2 Years

Application Areas:
The S-7000 is ideal for BGA void analysis, PCB solder joint inspection, mobile flex cable inspection, SMT assembly inspection, semiconductor component inspection, LED chip inspection, battery inspection and internal defect detection of electronic components. It is a powerful solution for repair centers, electronics manufacturers, R&D laboratories and quality control departments that require accurate and repeatable X-ray inspection results.