The S-7000i 90 kV X-Ray Inspection Machine is a professional non-destructive testing system developed for high-definition internal inspection of electronic products, semiconductor components, PCB assemblies, BGA solder joints, batteries, connectors and precision industrial parts. The system combines micro-focus X-ray technology, digital imaging, computer image processing, mechanical motion control, electrical control, safety protection and intelligent algorithm-based inspection functions.

This equipment is designed to inspect the internal structure of products by using the difference in X-ray absorption between different materials and thicknesses. It provides real-time high-definition inspection images and helps users identify the presence, type and level of internal defects. With customizable algorithm models, the S-7000i can support automatic defect judgment according to user requirements, improving consistency, accuracy and objectivity during inspection.

The S-7000i features a Chinese closed micro-focus X-ray source with 0–90 kV voltage range, 10–200 uA current range, 5 μm focus size and 8 W maximum power. Its amorphous silicon flat panel detector provides a 130 mm × 130 mm imaging area, 85 μm photosensitive unit size, 1536 × 1536 pixel matrix, 5.8 LP/mm resolution and 20 fps image frame rate. The loading platform supports a 500 mm × 440 mm loading area, 480 mm × 420 mm maximum inspection area and up to 10 kg sample weight.

The software system includes automatic image setting, coordinate and parameter recording, automatic navigation, bubble measurement, customizable detection algorithms and multi-point position detection. Movement control can be performed using joystick, mouse and keyboard, making the system practical for both routine inspection and detailed manual analysis.

Key Features:

• 90 kV professional X-ray inspection machine
• Micro-focus X-ray source with 5 μm focus size
• Amorphous silicon flat panel detector
• 1536 × 1536 pixel matrix
• 130 mm × 130 mm imaging area
• 20 fps image frame rate
• 480 mm × 420 mm maximum inspection area
• Automatic image setting and navigation
• Bubble measurement for electronic and semiconductor products
• Customizable detection algorithm models
• Multi-point position detection
• Joystick, mouse and keyboard control
• Steel-lead-steel protective casing
• Leaded glass front door window
• Safety interlock system for door protection
• Radiation leakage less than 1 μSv/h

Technical Specifications:

• Model: S-7000i
• Equipment Type: X-Ray Inspection Machine
• Equipment Specification: 90 kV
• X-Ray Source: Closed Microfocus X-ray Source
• Voltage / Current: 0–90 kV, 10–200 uA
• Focus Size: 5 μm
• Max X-Ray Source Power: 8 W
• Detector Type: Amorphous Silicon Flat Panel Detector
• Imaging Area: 130 mm × 130 mm
• Photosensitive Unit Size: 85 μm
• Pixel Matrix: 1536 × 1536
• Resolution: 5.8 LP/mm
• Image Frame Rate: 20 fps
• Loading Area: 500 mm × 440 mm
• Maximum Inspection Area: 480 mm × 420 mm
• Maximum Sample Weight: 10 kg
• Movement Control: Joystick, Mouse and Keyboard
• Power Supply: 220 V / 50–60 Hz
• Max Power: 1600 W
• Equipment Dimensions: 1400 × 1400 × 1600 mm
• Machine Weight: Approximately 1250 kg
• Radiation Leakage Dose: < 1 μSv/h

Application Areas:
The S-7000i is suitable for QFP IC inspection, HDMI connector inspection, pouch cell battery inspection, FPC inspection, BGA voiding analysis, 18650 battery inspection, semiconductor IC inspection, LED chip bubble inspection and flexible PCB inspection. It is a reliable inspection solution for electronics manufacturing, repair laboratories, semiconductor quality control, battery testing and industrial non-destructive inspection applications.