The WDS-620 Semi-Automatic BGA Rework Station is designed for accurate BGA chip removal, soldering, placement and repair operations. It is suitable for professional electronics repair centers, motherboard repair workshops, mobile phone repair laboratories, industrial PCB repair departments and technical service environments that require precise temperature control and optical alignment.

The WDS-620 uses an independent three-zone temperature control system. The upper and lower heating zones use hot air, while the bottom IR preheating zone uses infrared heating. This structure allows the PCB to be heated evenly from both top and bottom, helping to reduce board deformation and improve soldering quality during BGA rework. The system supports 8-segment temperature profile control, allowing users to create stable and repeatable heating curves for different chip and PCB types.

For precise process control, the machine uses a high-precision K-type thermocouple closed-loop control system with PID parameter self-tuning. It can display four temperature curves, store multiple sets of user data and support instant curve analysis. The external temperature measurement interface allows real-time analysis and calibration of actual BGA temperature curves.

The WDS-620 is equipped with a high-definition adjustable CCD color optical vision system. Its optical alignment system supports beam splitting, magnification, reduction and autofocus functions. Automatic color difference resolution and brightness adjustment help users obtain a clear alignment image. The 15” HD LCD display, touchscreen interface and micrometer adjustment system make the machine practical for accurate chip positioning.

Key Features:

• Semi-automatic BGA rework station
• Independent three-zone temperature control
• Upper and lower hot air heating
• Large-area infrared bottom preheating
• 8-segment temperature profile control
• High-precision K-type thermocouple closed-loop control
• PID parameter self-tuning system
• Four temperature curve display
• Multiple user data storage
• External temperature measurement interface
• HD CCD optical alignment system
• Beam splitting, magnification, reduction and autofocus
• 15” HD LCD display
• Touchscreen operating interface
• 360-degree rotatable titanium alloy BGA nozzles
• X, Y and R fine adjustment with micrometers
• Mounting accuracy up to ±0.01 mm
• Five operating modes: disassembly, soldering, placement, semi-automatic and manual
• Adjustable air speed with saved fan speed and temperature curve data

Technical Specifications:

• Model: WDS-620
• Product Type: BGA Rework Station
• Device Level: Semi-Automatic
• Total Power: 5200 W
• Upper Heating Power: 1200 W
• Lower Heating Power: 1200 W
• Lower IR Heating Power: 2700 W / 1200 W controlled
• Power Supply: AC 220 V ±10%, 50 Hz
• Positioning Method: V-shaped slot, adjustable PCB bracket, laser positioning light
• Temperature Control: K-type thermocouple closed-loop control
• Electrical System: Touchscreen + temperature control module + PLC + stepper driver
• Maximum PCB Size: 470 × 380 mm
• Minimum PCB Size: 10 × 10 mm
• PCB Thickness: 0.3–5 mm
• Applicable Chip Size: 1 × 1 mm to 70 × 70 mm
• Minimum Chip Spacing: 0.15 mm
• Chip Magnification: 2–32 times
• Temperature Measurement Interfaces: 1 pc
• Maximum Mounting Load: 300 g
• Mounting Accuracy: ±0.01 mm
• Overall Dimensions: 605 × 655 × 710 mm
• Machine Weight: 55 kg

Application Areas:
The WDS-620 is ideal for BGA chip rework, motherboard repair, laptop board repair, smartphone board repair, industrial PCB repair, chip replacement, soldering, desoldering and component placement. Its three-zone heating system, optical alignment and precise mechanical adjustment make it a practical solution for technicians who need reliable and repeatable BGA rework performance.